[D-1-4] Back-Side Illuminated CMOS Image Sensor Fabricated using Compliant Bump

N. Watanabe¹, I. Tsunoda², T. Takao¹, K. Tanaka³, T. Asano¹ (1.Kyushu Univ.(Japan), 2.Kyushu Inst. Of Tech.(Japan), 3.Kyushu Sangyo Univ.(Japan))

https://doi.org/10.7567/SSDM.2009.D-1-4