2009 International Conference on Solid State Devices and Materials

Oct 6, 2009 - Oct 9, 2009
Sendai Kokusai Hotel, Miyagi, Japan

[D-4-1] Patterning & Metallization Options for Advanced Contact Module Integration

S. Demuynck¹ (1.IMEC)

https://doi.org/10.7567/SSDM.2009.D-4-1

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