[D-4-2] Effect of Via-Profile on the Via Reliability in Scaled-down Low-k/Cu Interconnects

I. Kume¹、N. Inoue¹、S. Saito¹、N. Furutake¹、J. Kawahara¹、Y. Hayashi¹ (1.NEC Electronics Corp.)

https://doi.org/10.7567/SSDM.2009.D-4-2