[D-4-2] Effect of Via-Profile on the Via Reliability in Scaled-down Low-k/Cu Interconnects

I. Kume¹, N. Inoue¹, S. Saito¹, N. Furutake¹, J. Kawahara¹, Y. Hayashi¹ (1.NEC Electronics Corp.)

https://doi.org/10.7567/SSDM.2009.D-4-2