[D-4-3] On the Reliability of Cu Contacts for the 32nm Technology Node and beyond

T. Kauerauf¹, S. Demuynck¹, G. Butera¹, J. Bogan¹, Zs. Tökei¹, G. Groeseneken¹ (1.IMEC)

https://doi.org/10.7567/SSDM.2009.D-4-3