[D-4-3] On the Reliability of Cu Contacts for the 32nm Technology Node and beyond

T. Kauerauf¹、S. Demuynck¹、G. Butera¹、J. Bogan¹、Zs. Tökei¹、G. Groeseneken¹ (1.IMEC)

https://doi.org/10.7567/SSDM.2009.D-4-3