Integration and dielectric reliability of 30nm ½ pitch structures in Aurora ®LK HM

S. Demuynck; C. Huffman; M. Claes; S. Suhard; J. Versluijs; H. Volders; N. Heylen; K. Kellens; K. Croes; H. Struyf; G. Vereecke; P. Verdonck; D. De Roest; J. Beynet; H. Sprey; G. P. Beyer

doi:https://doi.org/10.7567/SSDM.2009.D-9-5

[D-9-5] Integration and dielectric reliability of 30nm ½ pitch structures in Aurora ®LK HM

S. Demuynck¹, C. Huffman¹, M. Claes¹, S. Suhard¹, J. Versluijs¹, H. Volders¹, N. Heylen¹, K. Kellens¹, K. Croes¹, H. Struyf¹, G. Vereecke¹, P. Verdonck¹, D. De Roest², J. Beynet², H. Sprey², G. P. Beyer¹ (1.IMEC(Belgium), 2.ASM Belgium(Belgium))

https://doi.org/10.7567/SSDM.2009.D-9-5

2009 International Conference on Solid State Devices and Materials

[D-9-5] Integration and dielectric reliability of 30nm ½ pitch structures in Aurora ®LK HM