Integration and dielectric reliability of 30nm ½ pitch structures in Aurora ®LK HM

S. Demuynck; C. Huffman; M. Claes; S. Suhard; J. Versluijs; H. Volders; N. Heylen; K. Kellens; K. Croes; H. Struyf; G. Vereecke; P. Verdonck; D. De Roest; J. Beynet; H. Sprey; G. P. Beyer

doi:https://doi.org/10.7567/SSDM.2009.D-9-5

[D-9-5] Integration and dielectric reliability of 30nm ½ pitch structures in Aurora ®LK HM

S. Demuynck¹、C. Huffman¹、M. Claes¹、S. Suhard¹、J. Versluijs¹、H. Volders¹、N. Heylen¹、K. Kellens¹、K. Croes¹、H. Struyf¹、G. Vereecke¹、P. Verdonck¹、D. De Roest²、J. Beynet²、H. Sprey²、G. P. Beyer¹ (1.IMEC(Belgium)、2.ASM Belgium(Belgium))

https://doi.org/10.7567/SSDM.2009.D-9-5

2009 International Conference on Solid State Devices and Materials

[D-9-5] Integration and dielectric reliability of 30nm ½ pitch structures in Aurora ®LK HM