Defect-free Isolation on High-Thermal-Conductivity SOI Substrates for Complementary BiCMOS Technology

K. Van Wichelen; P. Ong; A. Moussa; D. Radisic; K. Devriendt; S. Halder; K. Kenis; W. Lee; B. Vandevelde; C. Soonekindt; S. A. Hadi; T. Smet; S. Van Huylenbroeck; S. Decoutere; M. Seacrist; M. Ries; V. Drobny; R. Wise

doi:https://doi.org/10.7567/SSDM.2009.E-5-1L

[E-5-1L] Defect-free Isolation on High-Thermal-Conductivity SOI Substrates for Complementary BiCMOS Technology

K. Van Wichelen¹, P. Ong¹, A. Moussa¹, D. Radisic¹, K. Devriendt¹, S. Halder¹, K. Kenis¹, W. Lee¹, B. Vandevelde¹, C. Soonekindt¹, S. A. Hadi¹, T. Smet¹, S. Van Huylenbroeck¹, S. Decoutere¹, M. Seacrist², M. Ries², V. Drobny³, R. Wise³ (1.IMEC(Belgium), 2.MEMC(US), 3.Texas Instruments(US))

https://doi.org/10.7567/SSDM.2009.E-5-1L

2009 International Conference on Solid State Devices and Materials

[E-5-1L] Defect-free Isolation on High-Thermal-Conductivity SOI Substrates for Complementary BiCMOS Technology