[E-5-1L] Defect-free Isolation on High-Thermal-Conductivity SOI Substrates for Complementary BiCMOS Technology

K. Van Wichelen¹、P. Ong¹、A. Moussa¹、D. Radisic¹、K. Devriendt¹、S. Halder¹、K. Kenis¹、W. Lee¹、B. Vandevelde¹、C. Soonekindt¹、S. A. Hadi¹、T. Smet¹、S. Van Huylenbroeck¹、S. Decoutere¹、M. Seacrist²、M. Ries²、V. Drobny³、R. Wise³ (1.IMEC(Belgium)、2.MEMC(US)、3.Texas Instruments(US))

https://doi.org/10.7567/SSDM.2009.E-5-1L