The Influence of Mechanical Stress on Data Retention in Advanced NAND Flash

S. W. Seo; H. Oh; Y. Yang; S. M. Yi; S. Y. Kim; P. Kim; D. K. Lee; H. Yang; H. Lee; M. K. Cho; K. O. Ahn; Y. Koh

doi:https://doi.org/10.7567/SSDM.2009.G-4-3

2009 International Conference on Solid State Devices and Materials

Oct 6, 2009 - Oct 9, 2009
Sendai Kokusai Hotel, Miyagi, Japan

[G-4-3] The Influence of Mechanical Stress on Data Retention in Advanced NAND Flash

S. W. Seo¹, H. Oh¹, Y. Yang¹, S. M. Yi¹, S. Y. Kim¹, P. Kim¹, D. K. Lee¹, H. Yang¹, H. Lee¹, M. K. Cho¹, K. O. Ahn¹, Y. Koh¹ (1.Hynix Semiconductor Inc.)

https://doi.org/10.7567/SSDM.2009.G-4-3

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