[C-4-04] Via-last Cu-TSV fabrication on LSI wafer using WNi as barrier/seed layer for 3D integration _ a feasibility study on WNi-CMP

〇Murugesan Mariappan¹, JC Bea¹, M Koyanagi¹, T Fukushima¹ (1.GINTI, Tohoku University)

2021 International Conference on Solid State Devices and Materials |Wed. Sep 8, 2021 11:29 AM - 11:36 AM |PDF Download

[C-4-05] Experiments and Simulations of Ultrasonic Bonding for Al Bump Arrays

Pin-Kuan Li¹, Hai-Wen Hung¹, 〇Yuan-Kuan Chen¹, Wallace Chuang², Eckart Schellkes², Yasuda Kiyokazu³, Jenn-Ming Song¹ (1.Department of Materials Science and Engineering, National Chung Hsing University, Taichung, Taiwan, 2..Automotive Electronics Department, Robert Bosch Taiwan Co., Ltd, Taipei 104, Taiwan, 3.Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University Osaka, 565-0871 Japan)

2021 International Conference on Solid State Devices and Materials |Wed. Sep 8, 2021 11:36 AM - 11:43 AM |PDF Download

[C-4-06] Re liable Low-Temperature Bonding between Flexible Substrates Using Nanocomposite Pastes

〇YINCHI - LU¹ (1.Department of Materials Science and Engineering, National Chung Hsing University, Taichung 402, Taiwan)

2021 International Conference on Solid State Devices and Materials |Wed. Sep 8, 2021 11:43 AM - 11:50 AM |PDF Download

[C-4-07] Low-temperature deposited SiN_x films for TSV in 3D-LSI

〇Masaru Sato¹, Mayumi B. Takeyama¹ (1.Kitami Inst. of Tech.)

2021 International Conference on Solid State Devices and Materials |Wed. Sep 8, 2021 11:50 AM - 11:57 AM |PDF Download

[C-5-01 (Invited)] Haptic MEMS Based on Novel Ultra-Thin MEMS Technology

〇Takeshi Kobayashi¹, Toshiihro Takeshita¹ (1.National Institute of Advanced Industrial Science and Technology (AIST))

2021 International Conference on Solid State Devices and Materials |Wed. Sep 8, 2021 2:00 PM - 2:30 PM |PDF Download

[C-5-02] Layer-by-Layer Printing Strategy for High-Performance Flexible Electronic Devices with Low-temperature Catalyzed Solution-processed SiO₂ (LCSS)

〇Qingqing Sun¹, Xuying Liu¹, Takeo Minari² (1.Zhengzhou University, 2.National institute for materials science)

2021 International Conference on Solid State Devices and Materials |Wed. Sep 8, 2021 2:30 PM - 2:37 PM |PDF Download

[C-5-03] Differential Signal Balancer Embedded in Silicon LSI with Bifilar Coupling Inductors and Stacked Delay Lines

〇Masaaki Kameya¹, Eishi Gofuku¹, Kazuyuki Nakamura¹ (1.Kyushu Institute of Tech.)

2021 International Conference on Solid State Devices and Materials |Wed. Sep 8, 2021 2:37 PM - 2:44 PM |PDF Download

[C-5-04] Study on spin transport properties in multilayer including Pt and NiO layers

〇Akinobu Yamaguchi¹, Nobuko Matsumoto², Wataru Yoshikawa², Yasuhisa Fujii² (1.Univ. of Hyogo, 2.KRI inc.)

2021 International Conference on Solid State Devices and Materials |Wed. Sep 8, 2021 2:44 PM - 2:51 PM |PDF Download

[C-5-05] Mapping of Contactless Photoelectrochemical Etched GaN Schottky Contacts Using Scanning Internal Photoemission Microscopy --- Difference in Electrolytes ---

〇Kenji Shiojima¹, Ryo Matsuda¹, Fumimasa Horikiri², Yoshinobu Narita², Noboru Fukuhara², Tomoyoshi Mishima³ (1.Univ. of Fukui, 2.SCIOCS, 3.Hosei Univ.)

2021 International Conference on Solid State Devices and Materials |Wed. Sep 8, 2021 2:51 PM - 2:58 PM |PDF Download

[C-5-06] Minimizing substrate and interface effects to pattern aligned SiGe nanopores

〇Cian Cummins¹, Abhilash Paneri¹, Kouhei Takahashi ², Sandeep S Saseendran¹, Deniz S Tezcan ¹ (1.Imec, 2.Panasonic Corporation)

2021 International Conference on Solid State Devices and Materials |Wed. Sep 8, 2021 2:58 PM - 3:05 PM |PDF Download