1:00 PM - 1:30 PM
Presentation information
Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices
[Packaging III] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices
Thu. Jun 30, 2022 1:00 PM - 2:40 PM Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)
Chairman:Tetsuya Enomoto(Showa Denko Materials), Takumi Ueno(Shinshu University)