The 39th International Conference of Photopolymer Science and Technology

講演情報

印刷

Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

[Packaging III] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

2022年6月30日(木) 13:00 〜 14:40 Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)

Chairman:Tetsuya Enomoto(Showa Denko Materials), Takumi Ueno(Shinshu University)

13:30 〜 13:50

[3A1011] Low Transmission Loss Cu Wirings with Smooth Seed Layer and High Adhesion against Prepregs

*Kazue Hirano1 (1. Showa Denko Materials Co.,Ltd.)