The 39th International Conference of Photopolymer Science and Technology

講演情報

印刷

Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

[Packaging III] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

2022年6月30日(木) 13:00 〜 14:40 Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)

Chairman:Tetsuya Enomoto(Showa Denko Materials), Takumi Ueno(Shinshu University)

14:10 〜 14:40

[3A1013] Thin film polymers for advanced packaging - improved material properties in new applications [Invited]

*Markus Woehrmann1, Michael Schiffer1, Martin Schneider-Ramelow2 (1. Fraunhofer IZM, 2. Technical University of Berlin)