The 63rd JSAP Spring Meeting, 2016

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Oral presentation

8 Plasma Electronics » 8.4 Plasma etching

[19p-W621-1~12] 8.4 Plasma etching

Sat. Mar 19, 2016 2:30 PM - 5:45 PM W621 (W6)

Hisataka Hayashi(TOSHIBA), Koji Eriguchi(Kyoto Univ.)

5:30 PM - 5:45 PM

[19p-W621-12] Dry Desmear technology for High-density Packaged PCB.

Muneyuki Satou1, Yasuhiro Morikawa1, 〇Takahide Murayama1, Noriaki Tani1, Yoneda Masahiro1 (1.ULVAC, Inc.)

Keywords:Build-up PCB,Dry Desmear,Reactive Ion Etching, RIE