[K403-3pm] Colloidal Dispersion and Aggregation for Future Battery and Electronic Material Technologies

[K403-3pm-03] Numerical simulation of the formation and response of colloidal structures during fabrication process: dispersing, coating, and drying

^○Rei Tatsumi¹ (1. UTokyo)

[Lang.] Japanese

Keywords:Colloid, Direct numerical simulation, Langevin dynamics, Rheology