The 39th International Conference of Photopolymer Science and Technology

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Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

[Packaging II] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

Thu. Jun 30, 2022 10:40 AM - 12:00 PM Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)

Chairman:Sanjay Malik(FUJIFILM ELECTRONIC MATERIALS U.S.A.), Akira Watanabe(Tohoku University)

10:40 AM - 11:00 AM

[3A1006] Highly stable flexible tactile pressure sensor array

*Haruki Nakamura1, Seiji Wakabayashi1, Satoko Honda1, Takayuki Arie1, Seiji Akita1, Kuniharu Takei1 (1. Osaka Prefecture University)