The 39th International Conference of Photopolymer Science and Technology

講演情報

印刷

Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

[Packaging III] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

2022年6月30日(木) 13:00 〜 14:40 Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)

Chairman:Tetsuya Enomoto(Showa Denko Materials), Takumi Ueno(Shinshu University)

13:00 〜 13:30

[3A1010] Material for Microelectronics Packaging Development Trends from Patents analysis [Invited]

*Masao Tomikawa1 (1. Toray Industries Inc.)