The 39th International Conference of Photopolymer Science and Technology

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Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

[Packaging III] Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices

Thu. Jun 30, 2022 1:00 PM - 2:40 PM Strategies and Materials for Advanced Packaging, Next Generation MEMS, Flexible Devices (A10)

Chairman:Tetsuya Enomoto(Showa Denko Materials), Takumi Ueno(Shinshu University)

1:30 PM - 1:50 PM

[3A1011] Low Transmission Loss Cu Wirings with Smooth Seed Layer and High Adhesion against Prepregs

*Kazue Hirano1 (1. Showa Denko Materials Co.,Ltd.)