11:15 AM - 11:30 AM
[19a-B4-9] Room-Temperature Micro-I/O interconnect of qVGA Array Using Ultrasonic Bonding of Compliant Bump
Keywords:Compliant Bump
Presentation information
Oral presentation
13. Semiconductors A (Silicon) » 13.8 Basics and applications of MEMS, NEMS: Integration of diverse functionalities
[19a-B4-1~12] 13.8 Basics and applications of MEMS, NEMS: Integration of diverse functionalities
Thu. Sep 19, 2013 9:00 AM - 12:15 PM B4 (TC2 1F-106)