The 74th JSAP Autumn Meeting,2013

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13. Semiconductors A (Silicon) » 13.4 Interconnection technology

[19a-C10-1~9] 13.4 Interconnection technology

Thu. Sep 19, 2013 9:30 AM - 12:00 PM C10 (TC3 2F-207)

10:45 AM - 11:00 AM

[19a-C10-5] Formation of Cu film on Ru surface using electroless neutral Cu plating

○Osamu Sugiura1 (Chiba Inst. of Tech.1)

Keywords:無電解銅めっき