Electrical Characteristics of TSV Fabricated Using Via-last process

Presentation information

Oral presentation

13. Semiconductors A (Silicon) » 13.4 Interconnection technology

Thu. Sep 19, 2013 9:30 AM - 12:00 PM C10 (TC3 2F-207)

11:15 AM - 11:30 AM

^○Kenichi Takeda^1,2, Mayu Aoki^1,2, Kazuyuki Hozawa^1,2, Toshio Mitsuhashi², Hidekazu Kikuchi², Azusa Yanagisawa² (Hitachi CRL¹, ASET²)

Keywords:TSV