The 74th JSAP Autumn Meeting,2013

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13. Semiconductors A (Silicon) » 13.5 Si process technology

[19p-B4-1~21] 13.5 Si process technology

Thu. Sep 19, 2013 1:30 PM - 7:00 PM B4 (TC2 1F-106)

2:00 PM - 2:15 PM

[19p-B4-3] Investigation on Cracks Reduction by Buffer Layers in Thermal-Plasma-Jet Crystallized Amorphous Silicon Films on Glass Substrate

○Keisuke Tanaka1, shohei Hayashi1, Takahiro Kamikura1, Seiichiro Higashi1 (Grad. School of AdSM, Hiroshima Univ.1)

Keywords:クラック,ガラス基板,急速熱処理