The 74th JSAP Autumn Meeting,2013

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Oral presentation

13. Semiconductors A (Silicon) » 13.5 Si process technology

[20a-B4-1~11] 13.5 Si process technology

Fri. Sep 20, 2013 9:00 AM - 12:00 PM B4 (TC2 1F-106)

9:00 AM - 9:15 AM

[20a-B4-1] Scallop reduction processing of Si trench sidewalls by ICP-RIE using F2+He gas

○Ryo Mikasa1, Satoko Shinkai2, Yuki Noda3, Shinichi Motoyama3 (Kyushu Inst. of Tech.1, CMS, Kyushu Inst. of Tech.2, SAMCO Inc.3)

Keywords:F2,ICP-RIE,scallop