The 74th JSAP Autumn Meeting,2013

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13. Semiconductors A (Silicon) » 13.5 Si process technology

[20a-B4-1~11] 13.5 Si process technology

Fri. Sep 20, 2013 9:00 AM - 12:00 PM B4 (TC2 1F-106)

9:15 AM - 9:30 AM

[20a-B4-2] Technique of Wide Area Si Etching with ClF3 Cluster Beam

○Yu Yoshino1, Takehiko Senoo1, Kunihiko Koike1, Toshio Seki2, Takaaki Aoki2, Jiro Matsuo2 (Iwatani Corp.1, Kyoto Univ.2)

Keywords:MEMS,Siエッチング,TSV