[27p-PB4-1~16] 13.5 Si process technology

[27p-PB4-7] △Fabrication and Characterization of Mesa-Etched Si junctions by Using Surface-Activated Bonding

^○M Morimoto¹, J Liang¹, T Miyazaki¹, S Nishida¹, N Shigekawa¹ (Osaka city Univ¹)

Keywords:表面活性化ボンディング、メサエッチング