The 61st JSAP Spring Meeting, 2014

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Poster presentation

15. Crystal Engineering » 15.6 IV-group-based compounds

[17a-PG3-1~15] 15.6 IV-group-based compounds

Mon. Mar 17, 2014 9:30 AM - 11:30 AM PG3 (G棟2階)

9:30 AM - 11:30 AM

▲ [17a-PG3-6] Impact of the atomic-step finishing by CMP on the wettability of SiC substrates

○Gemma Rius1, Yuji Hirose1, Yayoi Tanaka1, Osamu Eryu1 (Nagoya Institute of Tecnology1)

Keywords:CMP,Wettability,Electronic devices