The 61st JSAP Spring Meeting, 2014

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13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[18a-E14-1~10] 13.3 Si Process・Interconnect・MEMS・Integration

Tue. Mar 18, 2014 9:00 AM - 11:45 AM E14 (E302)

10:00 AM - 10:15 AM

[18a-E14-5] Technique of Wide Area Si Etching with ClF3 Cluster Beam (2)

○Yu Yoshino1, Takehiko Senoo1, Kunihiko Koike1, Toshio Seki2, Takaaki Aoki2, Jiro Matsuo2 (Iwatani Corp.1, Kyoto Univ.2)

Keywords:Siエッチング