[18p-E14-1~21] 13.3 Si Process・Interconnect・MEMS・Integration

△ [18p-E14-18] Annealing temperature dependence of SAB based Si/Si junctions

^○Masashi Morimoto¹, J Laing¹, S Nishida¹, N Shigekawa¹, Li Chai¹, K Takemura¹, T Hayashi¹ (Osaka city Univ¹)

Keywords:SAB,表面活性化ボンディング,suraface acitivated bonding