The 61st JSAP Spring Meeting, 2014

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13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[18p-E14-1~21] 13.3 Si Process・Interconnect・MEMS・Integration

Tue. Mar 18, 2014 1:15 PM - 6:45 PM E14 (E302)

6:30 PM - 6:45 PM

[18p-E14-21] Effect Analysis of Size Fluctuation of the Fine Line-patterns Buckling

○Keisuke Unosawa1, Sachiyo Ito1, Keiji Suzuki1 (Toshiba Corporate Manufacturing Engineering Center1)

Keywords:半導体,応力シミュレーション,微細構造の座屈