The 61st JSAP Spring Meeting, 2014

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Oral presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[18p-E14-1~21] 13.3 Si Process・Interconnect・MEMS・Integration

Tue. Mar 18, 2014 1:15 PM - 6:45 PM E14 (E302)

1:45 PM - 2:00 PM

[18p-E14-3] In-Situ Observation of Ultrasonic Bonding of Cone Bump Using High Speed Camera

○Takanori Shuto1,2, Tanemasa Asano1 (Kyushu Univ.1, JSPS Research Fellow2)

Keywords:超音波接合,常温実装