The 61st JSAP Spring Meeting, 2014

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Poster presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[19p-PG3-1~32] 13.3 Si Process・Interconnect・MEMS・Integration

Wed. Mar 19, 2014 4:00 PM - 6:00 PM PG3 (G棟2階)

4:00 PM - 6:00 PM

[19p-PG3-10] Electroplating of Ni-W Alloy film for wavelength-selective surface

○（D）Shun Na1, Kentaro Iwami1, Norihiro Umeda1 (Tokyo Univ. of Agriculture and Technology1)

Keywords:MEMS,半導体