[19p-PG3-1~32] 13.3 Si Process・Interconnect・MEMS・Integration

[19p-PG3-30] Agglomeration and diffusion of Cu thin films in supercritical CO₂ fluid

^○Mitsuhiro Watanabe¹, Yoshiki Nakamura¹, Eiichi Kondoh¹ (Univ. Yamanashi¹)

Keywords:超臨界流体,銅,拡散