Norio Umeyama

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Speaker, Author, Co-Author

Fri. Sep 16, 2016 1:45 PM - 5:00 PM B10 (Exhibition Hall)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[16p-B10-1~12] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

1:45 PM - 2:00 PM

[16p-B10-1] Development and Characterization of Process Cutting Half-inch Wafers off a Large Wafer

〇Norio Umeyama^1,2, Takaaki Sakai³, Atsushi Kajikura³, Kouichiro Ichikawa³, Sommawan Khumpuang^1,2, Shiro Hara^1,2 (1.AIST, 2.MINIMAL, 3.Fujikoshi Machinery)

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