[15p-B10-1~17] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[15p-B10-15] Evaluation of Depth-dependent Interface States at TSV-liner SiO₂ Using Multi-well Structured TSV

〇Yohei Sugawara¹, Hisashi Kino², Takafumi Fukushima¹, Kang-Wook Lee³, Mitumasa Koyanagi³, Tetsu Tanaka^1,4 (1.Graduate School of Engineering of Tohoku Univ., 2.FRIS, Tohoku Univ., 3.NICHe, Tohoku Univ., 4.Graduate School of Biomedical Engineering of Tohoku Univ.)

Keywords:TSV, Interface state