[15p-B10-1~17] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[15p-B10-3] Sub-nanometer precision wet etching process of the SOI substrate

〇(M1)Mitsuki Kuwabara¹, Yasushi Takahashi¹ (1.Osaka Pref. Univ.)

Keywords:wet ecthing, SOI, siricon photonics

Operating wavelength range of silicon photonics manufactured on an SOI substrate is dependent on the core size of the device. It is also structural control in the vertical direction, not only in the horizontal direction is important towards the multiplexing of the operating wavelength and expanding of the operating wavelength range. We developed the etching process of Si layer by the sub-nanometer and manufactured an SOI substrate having different thicknesses.