The 63rd JSAP Spring Meeting, 2016

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[19p-S423-1~17] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

Sat. Mar 19, 2016 1:45 PM - 6:15 PM S423 (S4)

Tomoji Nakamura(Fujitsu Lab.), Kuniyuki Kakushima(Titech)

4:45 PM - 5:00 PM

[19p-S423-12] Characterization of W-silicide films composed of W-encapsulating Si clusters deposited using gas-phase reactions of WF6 with SiH4

Naoya Okada1,2, Noriyuki Uchida2, Toshihiko Kanayama2 (1.JST-PRESTO, 2.AIST)

Keywords:CVD,Silicide,Metal semiconductor junction

We formed W silicide films composed of WSin clusters by using a gas-phase reaction between WF6 and SiH4 in a hot-wall reactor. The formed films were amorphous semiconductors with an optical gap of ~0.8–1.5 eV, which increased as n increased from 8 to 12. We attribute this dependence to the reduction of randomness in the Si network as n increased, which decreased the densities of band tail states and localized states.