The 63rd JSAP Spring Meeting, 2016

Presentation information

Print

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[19p-S423-1~17] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

Sat. Mar 19, 2016 1:45 PM - 6:15 PM S423 (S4)

Tomoji Nakamura(Fujitsu Lab.), Kuniyuki Kakushima(Titech)

2:15 PM - 2:30 PM

△ [19p-S423-3] Forming Seed Film by Electroless Plating for Electrophoretic Si Via Filling

〇Kohei NITTA1, Ryo TAKIGAWA1, Akihiro IKEDA1, Mitsuaki KUMAZAWA2, Toshiharu HIRAI2, Michiro KOMATSU2, Tanemasa ASANO1 (1.Kyushu Univ., 2.JGC C&C)

Keywords:TSV,Electrophoretic,Electroless Plating