The 63rd JSAP Spring Meeting, 2016

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[21p-P17-1~26] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

Mon. Mar 21, 2016 4:00 PM - 6:00 PM P17 (Gymnasium)

4:00 PM - 6:00 PM

[21p-P17-19] Mechanical Characteristics of Structure Stability with Ti/Au Micro-Cantilevers Formed by Au Electroplating

Minami Teranishi1,2, Tso-Fu Mark Chang1,2, Chun-Yi Chen1,2, Toshifumi Konishi3, Katsuyuki Machida1,2,3, Hiroshi Toshiyoshi2,4, Daisuke Yamane1,2, Kazuya Masu1,2, Masato Sone1,2 (1.Tokyo Institute of Technology, 2.JST-CREST, 3.NTT AT Corp., 4.The University of Tokyo)

Keywords:MEMS,Ti/Au,Stability