[21p-P17-1~26] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

△ [21p-P17-19] Mechanical Characteristics of Structure Stability with Ti/Au Micro-Cantilevers Formed by Au Electroplating

〇Minami Teranishi^1,2, Tso-Fu Mark Chang^1,2, Chun-Yi Chen^1,2, Toshifumi Konishi³, Katsuyuki Machida^1,2,3, Hiroshi Toshiyoshi^2,4, Daisuke Yamane^1,2, Kazuya Masu^1,2, Masato Sone^1,2 (1.Tokyo Institute of Technology, 2.JST-CREST, 3.NTT AT Corp., 4.The University of Tokyo)

Keywords:MEMS,Ti/Au,Stability