The 63rd JSAP Spring Meeting, 2016

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[21p-P17-1~26] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

Mon. Mar 21, 2016 4:00 PM - 6:00 PM P17 (Gymnasium)

4:00 PM - 6:00 PM

[21p-P17-22] Study of Grain Boundary on Mechanical Properties of Aluminum Alloy Investigated by Micro Compression Test

BoLun Zheng1, Takashi Nagoshi1,2, Tso-Fu Mark Chang1, Hideki Hosoda1, Tatsuo Sato1, Masato Sone1 (1.Tokyo Tech., 2.AIST)

Keywords:Bi-crystal,Micro Compression,Aluminum