[21p-P17-1~26] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

△ [21p-P17-23] Mechanical Property Evaluation of Electrodeposited Gold for MEMS Device by Micro Bending Testing

〇Keisuke Asano^1,2, Hao-Chun Tang^1,2, Chun-Yi Chen^1,2, Tso-Fu Mark Chang^1,2, Daisuke Yamane^1,2, Katsuyuki Machida^1,2,3, Kazuya Masu^1,2, Masato Sone^1,2 (1.CREST, 2.Titech, 3.NTTAT)

Keywords:gold,cantilever,micro-bending testing