The 78th JSAP Autumn Meeting, 2017

Presentation information

Oral presentation

15 Crystal Engineering » 15.7 Crystal evaluation, impurities and crystal defects

[6a-A503-1~13] 15.7 Crystal evaluation, impurities and crystal defects

Wed. Sep 6, 2017 9:00 AM - 12:30 PM A503 (503)

Yuta Nagai(GlobalWafers Japan), Shotaro Takeuchi(Ohsaka Univ.)

9:30 AM - 9:45 AM

[6a-A503-3] Characteristic of Molecular Cluster Ion Implanted Epitaxial Silicon Wafer (2)
- Gettering Heavy Metal of Room Temperature Bonding Wafer -

Yoshihiro Koga1, Takeshi Kadono1, Ryosuke Okuyama1, Satoshi Shigematsu1, Ryo Hirose1, Ayumi Masada1, Hidehiko Okuda1, Kazunari Kurita1 (1.SUMCO CORPORATION)

Keywords:epitaxial silicon wafer, room templature bonding, heveay metal gettering

We have been studying new epitaxial silicon wafer that epitaxial silicon layer bonded on carbon-cluster ion implanted silicon substrate at room temperature for improvement of CMOS imager devices performance.
In this studying, we demonstrate that how much this wafer can getter heavy metal.