The 64th JSAP Spring Meeting, 2017

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[16a-E206-1~13] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Thu. Mar 16, 2017 9:00 AM - 12:15 PM E206 (E206)

Masato Sone(Titech), Masahide Goto(NHK)

10:15 AM - 10:30 AM

[16a-E206-6] Development of Water Plasma Ashing Technology for Minimal Fabrication System

Takeshi Aizawa1, Takeshi Yamada1, Mitsunori Nogawa1, Yasuhiro Onishi1, Noriko Miura1,3, Tatsuo Ishijima2, Takuya Kitano2, Hiroaki Suzuki2, Arufa Shiota2, Sommawan Khumpuang3,4, Shiro Hara3,4 (1.Yonekura MFG., 2.Kanazawa Univ., 3.Minimal, 4.AIST)

Keywords:minimal, ashing