The 64th JSAP Spring Meeting, 2017

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13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17a-E206-1~14] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Fri. Mar 17, 2017 9:00 AM - 12:45 PM E206 (E206)

Kuniyuki Kakushima(Titech), Tatsuya Okada(Univ. of the Ryukyus)

11:45 AM - 12:00 PM

△ [17a-E206-11] Solid-phase crystallization for large-grained Ge thin film on glass and demonstration of its high hole mobility

〇Ryota Yoshimine1, Kaoru Toko1, Takashi Suemasu1 (1.Univ. of Tsukuba)

Keywords:Germanium, solid-phase crystallization