The 64th JSAP Spring Meeting, 2017

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13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17a-E206-1~14] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Fri. Mar 17, 2017 9:00 AM - 12:45 PM E206 (E206)

Kuniyuki Kakushima(Titech), Tatsuya Okada(Univ. of the Ryukyus)

10:00 AM - 10:15 AM

[17a-E206-5] Reconsideration of Fermi level pinning based on redefinition of metal work function at M/S interface

〇Tomonori Nishimura1, Takeaki Yajima1, Akira Toriumi1 (1.The Univ. of Tokyo)

Keywords:work function, germanium, Fermi level pinning