[18a-233-1~10] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

△ [18a-233-1] Two-step Poly-Si through-silicon via for high-temperature process of bioprobe

〇Taiki Yasui¹, Shota Yamagiwa¹, Hiroshi Kubo¹, Shinnosuke Idogawa¹, Yoshihiro Kubota¹, Takeshi Kawano¹ (1.Toyohashi University of Technology)

Keywords:through-silicon via, poly-Si, bioprobe