[18a-233-1~10] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[18a-233-2] The Influence of SiC Film Surface Condition for Spherical Particle Formation on The Film by De-Ionized Water Washing

〇Eri Tahara¹, Tohru Fujita¹, Kengou Inoue¹, Masakatsu Tanaka¹, Rikiya Hoki¹, Naoki Idani¹, Toshifumi Mori¹ (1.Mie Fujitsu Semiconductor)

Keywords:semiconductor