The 79th JSAP Autumn Meeting, 2018

Presentation information

Oral presentation

21 Joint Session K » 21.1 Joint Session K "Wide bandgap oxide semiconductor materials and devices"

[20p-234A-1~18] 21.1 Joint Session K "Wide bandgap oxide semiconductor materials and devices"

Thu. Sep 20, 2018 1:30 PM - 6:30 PM 234A (234-1)

Masataka Higashiwaki(NICT), Tetsuya Yamamoto(Kochi Univ. of Tech.), Mutsumi Kimura(Ryukoku Univ.)

5:15 PM - 5:30 PM

[20p-234A-14] Drastic improvement of Schottky diode properties by Ar+O2+H2 sputtered InGaZnO

〇(DC)Yusaku Magari1, Kenichiro Hamada1, Kentaro Masuda1, Mamoru Furuta1,2 (1.Kochi Univ. of Tech., 2.Center for Nanotech.)

Keywords:InGaZnO, Schottky diode, Flexible device

An In-Ga-Zn-O (IGZO) has attracted particular attention owing to its high field effect mobility with large-area uniformity and suitable for flexible devices because the IGZO can be deposited by sputtering at room temperature. Until now the best Schottky diode properties of rectification ratio of 108, barrier height of 0.91 eV, and an ideal factor of 1.04 have been reported with a maximum process temperature of 200 °C. We demonstrated a Schottky diode properties with a rectification ratio of 1010, a barrier height of 1.17 eV and an ideal factor of 1.07 at the maximum process temperature of 150 °C by introducing hydrogen during the IGZO deposition.